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Back Issues >> August 2005

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August 2005:
Interconnects & Packaging 




Communications ICs; Controller & Driver ICs; Power Sources; Passive Components & Timing Devices; Cabinets & Enclosures; Boards & Modules; Design, Assembly & Test


[Front Cover]
Small 486/586 SBC Packs Wealth Of Features
Software Eases Multi-Platform Development
DDS Chips Provide Up To Four Channels
Module Eases Voice Recognition Integration
RCT Delivers Up to 3X Reduction in Java Memory Footprint


[Late Breaking Product News]
DSP Audio Platform Cranks Out The Volume
DC/DC IP Blocks Pump Up Battery Life
Configuration Tool Shrinks Design Cycles And Costs
RGB LEDs Boost Visibility


[Editor's Note]
Cooler Semis


[Design Win]
Atmel ICs Power SENAO's Wireless VoIP Phones


[Products by Category]
Board-Level & Modular Products (8)
Components & Assemblies (29)
Design, Assembly & Test (5)
Semiconductors (22)
Software (3)
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