Conduction Cooled Frames Stand Up To Severe Environments December 2000 Issue Published Date: December 01, 2000
Designed for circuit boards requiring cooling in severe environments where convection cooling is not possible, the Conduction Cooled Assemblies are standard-design frames, customized to match the board and application. They provide structural support for high shock/vibration situations and can be configured for compliance to IEEE 1101.2 and VITA 30.1 if needed. Features include injectors/ejectors, corrosion-resistant platings, and a sandwich structure that minimizes stress due to the various coefficients of thermal expansion. Custom silkscreening is available as well as custom designs with integrated heat pipes.
