3D Audio Subsystem Sits In Miniature Package October 2005 Issue Published Date: October 06, 2005
In a 30-bump micro SMD package that measures 2.5 mm x 3 mm, the LM4844 audio subsystem is designed to simplify the development of full-bandwidth stereo and 3D sound in mobile phones and other battery-powered devices. The device integrates 1.2W stereo speaker amplifiers and headphone drivers, a volume control, mixing, power management, 10 pre-programmed output modes, and 3D sound enhancement. Its headphone topology eliminates the need for output capacitors while improving low frequency response and reducing pops and clicks on the headphone driver. Specifications include 3.3V operation and an output power of 495 mW per channel into an 8Ω load and up to 33 mW into a 32Ω load via the headphone drivers. The subsystem is controlled through an I2C, interface, allowing users to utilize independent left, right, and mono volume controls. Price is $2 each/1,000. For more details, call NATIONAL SEMICONDUCTOR CORP., Santa Clara, CA. (800) 272-9959.
