Set-up PC Board Addresses Complex Space Apps November 04, 2009
Groomed for use by the folks at STI Electronics, Inc., the company’s complex, ruggedized PC board meets the temperature, reliability, performance, vibration, and G-force requirements for space applications. A unique method of fabrication is said to be responsible for a double sided PC board with a single tier cavity on a 50 mil copper core. The single tier design allows users to wire bond a semiconductor module to the copper core, which in turn provides both heat dissipation and rigidity. For further information, call ENDICOTT INTERCONNECT TECHNOLOGIES INC., Endicott, NY. (866) 820-4820.
