Drive Components Suit Low-Dust Apps

January 5, 2009   ·   MISUMI USA INC.

Providing a design option for ultra-low dust generating applications on assembly or transfer mechanisms, the company’s latest line of magnetic transmission drive components suit situations where the non-contacting components result in ultra low dust gener ... More >>

MOSFETs Enable Power Supplies To Meet 80 PLUS Silver Specs

January 5, 2009   ·   FAIRCHILD SEMICONDUCTOR

Exploiting the company’ advanced PowerTrench process, the FDP025N06, FDB024N06, FDP032N08, FDB031N08, FDP047N10, and FDB047N10 60V to 100V MOSFETs enable power supplies to meet the 80 PLUS Silver specification. The devices specify an on resistance as low ... More >>

19-Way Connector Includes Secondary Locking Mechanism

January 5, 2009   ·   ITT INDUSTRIES

The APD 19-way circular connector targets volume products requiring a technically robust component and is capable of withstanding harsh and wet-area environments. The connector features a unique secondary locking mechanism based on patent-pending technolo ... More >>

DIP SMT Rotary Switches Keep A Low Profile

January 5, 2009   ·   APEM COMPONENTS INC.

Space frugal and RoHS compliant, the P36 Series DIP coded rotary switches come in 7.4-mm square packages. They are available in surface-mount and through-hole configurations and are process sealed to ensure reliable operation. The switches are available i ... More >>

Actuator And Linear Slide Ease Motion Apps

January 5, 2009   ·   HAYDONKERK MOTION SOLUTIONS

The MotoDrive PDE actuator and MotoRGS motorized linear slide assembly are suitable for a wide range of motion chores. The MotoDrive PDE Actuator, available in size 17 single or double stack, is an integrated linear actuator and electronic drive that oper ... More >>

Thermal-Interface Material Rides Silicone Free

December 31, 2008   ·   MH&W INTERNATIONAL CORP.

For use where contamination concerns prohibit the use of silicone-based thermal pads, Keratherm U 90, a silicone-free thermal interface material, provides high levels of thermal conductivity. The material consists of a ceramic-filled polyurethane film wi ... More >>

Open-Access Chassis Supports 3U Backplanes

December 31, 2008   ·   ELMA ELECTRONIC INC.

Debuting as a 3U version of the company’s E-frame chassis line, the portable E-frame, formerly available in heights for 6U backplanes, now accommodates 3U heights. The unit does not have side or back walls around the card cage area, providing access for ... More >>