Accommodating 0.65-mm pitch LGA devices, the XG-LGA-7000 socket supports a 12-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. The component dissipates up to several watts without extra heat sinking and can handle up to 100W with a custom heat sink. Typical contact resistance is 50 milliOhms per pin. Featuring a low-inductance elastomer construction with a gold-plated, barbed pad connecting to the IC pad, operating temperature ranges from -40°C to +155°C. Other features include a pin self inductance of 0.11 nH, mutual inductance of 0.028 nH, capacitance to ground of 0.028 pF, and a current rating of 5A per pin. Additionally, an open lid option (XG-LGA-7001) allows die probing or direct injection of heat or cooling air. IRONWOOD ELECTRONICS, Burnsville, MN. (800) 404-0204.
